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Resin Diamond Dicing Blade
Resin Diamond Dicing Blade
Resin Diamond Dicing Blade

Resin Diamond Dicing Blade for Silicon Wafer

1A8 Ultra-thin diamond dicing blade (over 0.75mm)

Improve chipping, blade life on hard and brittle materials

Applications: glass, quartz, LiTa03 LiNb03, QFN, splitter, sapphire, ceramic, etc


Product Details

silicon wafer dicing blades

Resin bonded blades have excellent cutting ability that help reduce chippingm fractures, can efficiency improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramic.

Resin Diamond Dicing Blade for Silicon Wafer Resin Diamond Dicing Blade for Silicon Wafer

Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.

Resin Diamond Dicing Blade for Silicon Wafer wafer diamond dicing blade wafer diamond dicing blade

How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

Drawing&Specification
Grit Type OD (mm) ID(mm) T(mm) Grit Size
1A8 SD / CBN 50.8 25.4 0.07 – 0.3 #200 – #3000
57.1 38.1
50.8-76.2 40
101.6 ,114.3 69.8
101.6, 114.3, 127 76.2
108.1, 127 88.82
108.1, 127 88.9
Special size can be designed depending on customers’ requirement
Workpiece PCB  Material

1.2mm thick resin containing copper layer

Metal Diamond Dicing Blades

Dicing Requirements Cutting without burrs
Incision perpendicularity < 0.005mm
Cutting dimensional error < 0.02mm
Snake cutting is not allowed
Dicing / Scribing Machine Disco DAD3350 scribing machine
Diamond Dicing Blade

Diamond Dicing Blades

Metal Diamond Dicing Blade
58D x 0.15T x 40H (Grit 400# )
Cutting Parameters 1. Cutting direction: Straight cutting

2. Spindle speed: 30000rpm

3. Feed speed: 50mm/S

4. Cooling water: pure water

Inquiry

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