Electroformed Diamond Dicing Blade - Hub Type

Electroformed Diamond Dicing Blade - Hub Type

Hub type electroforming nickel bonded dicing blade

Blade thickness: 0.015 mm to 0.3 mm

Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.

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Product Details

diamond dicing blade

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.

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Applications of electroformed diamond dicing blade

Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.

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How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Drawing&Specification

diamond dicing blade

Exposure(μm)	380	510	640	760	890	1020	1150	1270	Grit Size
Kerf width(μm)	380-510	510-640	640-760	760-890	890-1020	1020-1150	1150-1270	1270-1400	#5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500
16-20	20*380	20*510
21-25	25*380	25*510	25*640
26-30	30*380	30*510	30*640	30*760	30*890	20*1020
31-35	35*380	35*510	35*640	35*760	35*890	35*1020
36-40	40*380	40*510	40*640	40*760	40*890	40*1020	40*1150
41-50	50*380	50*510	50*640	50*760	50*890	50*1020	50*1150
51-60		60*510	60*640	60*760	60*890	60*1020	60*1150	60*1270
61-70			70*640	70*760	70*890	70*1020	70*1150	70*1270
71-80					80*890	80*1020	80*1150	80*1270
81-90						90*1020	90*1150	90*1270
Special size can be designed according to customers' requirement