Electroformed Diamond Dicing Blade - Hub Type
Hub type electroforming nickel bonded dicing blade
Applications: dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spraying Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.
Applications of electroformed diamond dicing blade
Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers such as GaAs and SiC.
How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
| Exposure(μm) | 380 | 510 | 640 | 760 | 890 | 1020 | 1150 | 1270 | Grit Size |
| Kerf width(μm) | 380-510 | 510-640 | 640-760 | 760-890 | 890-1020 | 1020-1150 | 1150-1270 | 1270-1400 | #5000 #4800 #4500 #4000 #3500 #3000 #2500 #2000 #1800 #1700 #1500 |
| 16-20 | 20*380 | 20*510 | |||||||
| 21-25 | 25*380 | 25*510 | 25*640 | ||||||
| 26-30 | 30*380 | 30*510 | 30*640 | 30*760 | 30*890 | 20*1020 | |||
| 31-35 | 35*380 | 35*510 | 35*640 | 35*760 | 35*890 | 35*1020 | |||
| 36-40 | 40*380 | 40*510 | 40*640 | 40*760 | 40*890 | 40*1020 | 40*1150 | ||
| 41-50 | 50*380 | 50*510 | 50*640 | 50*760 | 50*890 | 50*1020 | 50*1150 | ||
| 51-60 | 60*510 | 60*640 | 60*760 | 60*890 | 60*1020 | 60*1150 | 60*1270 | ||
| 61-70 | 70*640 | 70*760 | 70*890 | 70*1020 | 70*1150 | 70*1270 | |||
| 71-80 | 80*890 | 80*1020 | 80*1150 | 80*1270 | |||||
| 81-90 | 90*1020 | 90*1150 | 90*1270 | ||||||
| Special size can be designed according to customers' requirement | |||||||||
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Workpiece |
PCB Material 1.2mm thick resin containing copper layer
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Dicing Requirements |
Cutting without burrs |
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Incision perpendicularity < 0.005mm |
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Cutting dimensional error < 0.02mm |
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Snake cutting is not allowed |
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Dicing / Scribing Machine |
Disco DAD3350 scribing machine |
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Diamond Dicing Blade
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Metal Diamond Dicing Blade |
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58D x 0.15T x 40H (Grit 400# ) |
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Cutting Parameters |
1. Cutting direction: Straight cutting 2. Spindle speed: 30000rpm
3. Feed speed: 50mm/S 4. Cooling water: pure water
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