Products

Metal bond Diamond Dicing BladesMetal bond Diamond Dicing BladesMetal bond Diamond Dicing Blades
Metal bond Diamond Dicing BladesMetal bond Diamond Dicing BladesMetal bond Diamond Dicing Blades

Metal bond Diamond Dicing Blades

1A8 Ultra- Thin metal diamond dicing blade 

Thickness of dicing blade: 0.08mm - 2mm

Application: cutting / scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, crystal, etc

Product Details

diamond dicing blade for wafer

Metal bond blades are using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time, high rigidity minimized wavy and slant cutting, able to control diamond concentration to achieve cutting quality, excellent rigidity and cut quality.

metal diamond dicing blade metal diamond dicing blade

 

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

 

Applications of metal diamond dicing blade

Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, quartz, crystal, etc

diamond dicing blade wafer diamond dicing blade diamond dicing blade

Drawing&Specification

Grit Type

OD (mm)

ID(mm)

T(mm)

Grit Size

1A8 SD / CBN

50.8 - 125

40/ 55/ 75/ 88.9

0.075 - 0.35

#200 - #3000

Special size can be designed depending on customers’ requirement

Inquiry

Please Feel free to give your inquiry in the form below. We will reply you in 24 hours.

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