Metal bond Diamond Dicing Blades

1A8 Ultra- Thin metal diamond dicing blade

Thickness of dicing blade: 0.08mm – 2mm

Application: cutting / scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, crystal, etc

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Product Details

silicon wafer dicing blades

Metal bond blades are using sintered metal powder as the bonding agent, have the excellent ability to hold its shape for a longer period of time, high rigidity minimized wavy and slant cutting, able to control diamond concentration to achieve cutting quality, excellent rigidity and cut quality.

dicing blades

How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

Applications of metal diamond dicing blade
Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, ceramic, glass, quartz, crystal, etc

wafer diamond dicing blade

Drawing&Specification

Grit Type	OD (mm)	ID(mm)	T(mm)	Grit Size
1A8 SD / CBN	50.8 – 125	40/ 55/ 75/ 88.9	0.075 – 0.35	#200 – #3000
Special size can be designed depending on customers’ requirement

Workpiece	PCB Material 1.2mm thick resin containing copper layer
Dicing Requirements	Cutting without burrs
	Incision perpendicularity < 0.005mm
	Cutting dimensional error < 0.02mm
	Snake cutting is not allowed
Dicing / Scribing Machine	Disco DAD3350 scribing machine
Diamond Dicing Blade	Metal Diamond Dicing Blade >
Diamond Dicing Blade	58D x 0.15T x 40H (Grit 400# )
Cutting Parameters	1. Cutting direction: Straight cutting 2. Spindle speed: 30000rpm 3. Feed speed: 50mm/S 4. Cooling water: pure water