LED and Semiconductor Industry
Manufacturing processes for silicon semiconductor in semocinductor
Silicon Ingot – Cropping(electroplated bandsaw) – Cylindrical / Flat Grinding Silicon Rod – Ingot Silicon (diamond wire) – Lapping (double side wheel/polishing pad) – Edge Grinding – Surface grinding – polishing- wafer- patterning – back grinding (vitrified / resin wheels) – dicing (dicing blades)- chips – molding – packaging
-
Back Grinding Wheel for LED SubstrateBack Grinding Wheel for LED Substrate
-
Edge Grinding Wheel, Silicon Wafer ChamferingEdge Grinding Wheel, Silicon Wafer Chamfering
-
Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD GrindingDiamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
-
Polyurethane (PU) Polishing Pad for Wafer SurfacePolyurethane (PU) Polishing Pad for Wafer Surface
-
Electroplated Diamond Band Saw BladesElectroplated Diamond Band Saw Blades
-
Si/SiO2 WaferSi/SiO2 Wafer
-
Diamond grinding tools for sapphire processing, silicon waferDiamond grinding tools for sapphire processing
-
Back Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon Wafer
-
Metal bond Diamond Dicing BladesMetal bond Diamond Dicing Blades
-
Electroformed Diamond Dicing Blade - Hub TypeElectroformed Diamond Dicing Blade – Hub Type
