LED and Semiconductor Industry
Manufacturing processes for silicon semiconductor in semocinductor
Silicon Ingot – Cropping(electroplated bandsaw) – Cylindrical / Flat Grinding Silicon Rod – Ingot Silicon (diamond wire) – Lapping (double side wheel/polishing pad) – Edge Grinding – Surface grinding – polishing- wafer- patterning – back grinding (vitrified / resin wheels) – dicing (dicing blades)- chips – molding – packaging
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Electroformed hub type diamond dicing blade for semiconductor packaging
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Polishing slurry
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Hexagon Resin diamond lapping pad
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Porous ceramic vacuum chuck
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Resin diamond grinding wheel for Ceramics Capillary
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Dressing board for dressing diamond dicing blade
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Electroplated CMP Pad Conditioner
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Back Grinding Wheel for LED Substrate
Back Grinding Wheel for LED Substrate
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Edge Grinding Wheel, Silicon Wafer Chamfering
Edge Grinding Wheel, Silicon Wafer Chamfering
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Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding