LED and Semiconductor Industry
Manufacturing processes for silicon semiconductor in semocinductor
Silicon Ingot – Cropping(electroplated bandsaw) – Cylindrical / Flat Grinding Silicon Rod – Ingot Silicon (diamond wire) – Lapping (double side wheel/polishing pad) – Edge Grinding – Surface grinding – polishing- wafer- patterning – back grinding (vitrified / resin wheels) – dicing (dicing blades)- chips – molding – packaging
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Electroplated CMP Pad Conditioner
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Back Grinding Wheel for LED SubstrateBack Grinding Wheel for LED Substrate
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Edge Grinding Wheel, Silicon Wafer ChamferingEdge Grinding Wheel, Silicon Wafer Chamfering
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Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD GrindingDiamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
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Polyurethane (PU) Polishing Pad for Wafer SurfacePolyurethane (PU) Polishing Pad for Wafer Surface
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Electroplated Diamond Band Saw BladesElectroplated Diamond Band Saw Blades
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Si/SiO2 WaferSi/SiO2 Wafer
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Diamond grinding tools for sapphire processing, silicon waferDiamond grinding tools for sapphire processing
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Back Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon Wafer
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Metal bond Diamond Dicing BladesMetal bond Diamond Dicing Blades
