LED and Semiconductor Industry
Manufacturing processes for silicon semiconductor in semocinductor
Silicon Ingot – Cropping(electroplated bandsaw) – Cylindrical / Flat Grinding Silicon Rod – Ingot Silicon (diamond wire) – Lapping (double side wheel/polishing pad) – Edge Grinding – Surface grinding – polishing- wafer- patterning – back grinding (vitrified / resin wheels) – dicing (dicing blades)- chips – molding – packaging
-
Resin diamond grinding wheel for Ceramics Capillary
-
Dressing board for dressing diamond dicing blade
-
Electroplated CMP Pad Conditioner
-
Back Grinding Wheel for LED Substrate
Back Grinding Wheel for LED Substrate
-
Edge Grinding Wheel, Silicon Wafer Chamfering
Edge Grinding Wheel, Silicon Wafer Chamfering
-
Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
Diamond Wheels for Silicon Ingot, Cylindrical Grinding/ OD Grinding
-
Polyurethane (PU) Polishing Pad for Wafer Surface
Polyurethane (PU) Polishing Pad for Wafer Surface
-
Electroplated Diamond Band Saw Blades
Electroplated Diamond Band Saw Blades
-
Si/SiO2 Wafer
Si/SiO2 Wafer
-
Diamond grinding tools for sapphire processing, silicon wafer
Diamond grinding tools for sapphire processing