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diamond dicing blades for wafer
diamond dicing blades for wafer

Diamond Dicing Blades For Wafer Scribing

1A8 Ultra-thin diamond dicing blade

Blade thickness: 0.03 mm – 0.3 mm

Silicon wafers of thickness:  0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm

Inducing as low as possible frontside and backside chipping of silicon wafer

Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc


Product Details

silicon wafer dicing blades

Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed . Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.

diamond dicing blades diamond dicing blades diamond dicing blades

How to selection of the correct types of wafer dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material

Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row,  to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge

Dresser Board for dressing dicing blades Dresser Board for dressing dicing blades

Applications of wafer diamond dicing blade
Scribing / cutting silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

wafer diamond dicing blade wafer diamond dicing blade wafer diamond dicing blade

Drawing&Specification
Types Features Product Name
 

Electroformed dicing blade

Electroformed dicing blade

• Good chip removal and cooling performance
• Can carry on the difficult angle cutting and the step cutting processing• By adjusting the blades strength, can reduce the snake like cutting and blade damage
• The workpiece has no flying edge, burr residue and high yield
 

 

 

 

Hub dicing blade

Application:  Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc
Resin bond dicing blade

 

Resin bond dicing blade

• High processing quality for cutting of hard, brittle materials

 

• Improved cut quality on hard materials

• Excellent cutting ability that help reduce chippingm fractures

 

 

 

 

 

 

 

 

 

Hubless dicing

blade

Application: cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN (copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc
metal bond dicing blades

Metal bond dicing balde

 

• High rigidity minimized wavy & slant cutting

• Excellent rigidity and cut quality

Application:  Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc
 

Electroformed dicing balde

Electroformed dicing balde

• Wide selection of blade options

• Proprietary thin-blade technology

• Blade thickness – 0.03 mm to 0.3 mm

• Available for both dicing saws and slicers

Application:  Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc
Other specification can be produced according to customers’ requirements

The Case of Metal Diamond Dicing Blades for PCB

Workpiece PCB  Material

1.2mm thick resin containing copper layer

Dicing Requirements Cutting without burrs
Incision perpendicularity < 0.005mm
Cutting dimensional error < 0.02mm
Snake cutting is not allowed
Dicing / Scribing Machine Disco DAD3350 scribing machine
Diamond Dicing Blade

Diamond Dicing Blades

Metal Diamond Dicing Blade
58D x 0.15T x 40H (Grit 400# )
Cutting Parameters 1. Cutting direction: Straight cutting

2. Spindle speed: 30000rpm

 

3. Feed speed: 50mm/S

4. Cooling water: pure water

 

 

Case of metal diamond dicing blade:

Our customer using  other brand diamond dicing blade have chipping before, but try Moresuperhard metal diamond dicing blade do not occur chipping.

diamond dicing blade diamond dicing blade

Blade size Ø52mm*Ø40mm*0.11mm
Workpiece size 2mm
RPM Speed 20,000 RPM
Feed Speed 700µm/s ( can adjust. Opening to cut is 0.12mm, and the depth of the cut is 0.18mm)
Depth of cut 200µm
Length of cut: 130mm
Cutting model Cutting model
Cut depth Cut depth
Coolant Water
Cutting Material

 

– Cubic Zirconia(8.5 hardness)

– Sapphire (9-Mohs hardness scale)

– Natural stone: Mohs hardness 7-8

Inquiry

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