Products

Resin Bond Diamond Dicing BladesResin Bond Diamond Dicing BladesResin Bond Diamond Dicing Blades
Resin Bond Diamond Dicing BladesResin Bond Diamond Dicing BladesResin Bond Diamond Dicing Blades

Resin Bond Diamond Dicing Blades

High precision dicing

Improved cut quality on hard materials

Superior cut quality

Good wear resistance

Product Details

Description:
Resin bond dicing blade can Cut sapphire, quartz glass, silicon and other hard and brittle materials with quality and high-speed.

Application:
Resin Bond Diamond Dicing Blades are suitable for cutting glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.

Advantages:
1.High precision dicing
2.Improved cut quality on hard materials
3.Superior cut quality
4.Good wear resistance

Drawing&Specification

Inner Diameter

Outer Diameter

Thickness

inches

mm

inches

mm

mm

1’’

25.4

2’’

50.8

0.07-2.00

1.5’’

38.1

2.25’’

57.1

1.575’’

40

2’’-3’’

50.8-76.2

2.75’’

 

69.8

4.4’’

101.6

4.5’’

114.3

3’’

76.2

4.4’’

101.6

4.5’’

114.3

5’’

127

3.497’’

88.82

4.256’’

108.1

4.6’’

116.8

4.7’’

119.4

5’’

127

3.5’’

88.9

4.256’’

108.1

4.6’’

116.8

Inquiry

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