Products

Resin Diamond Dicing Blade for Silicon WaferResin Diamond Dicing Blade for Silicon WaferResin Diamond Dicing Blade for Silicon Wafer
Resin Diamond Dicing Blade for Silicon WaferResin Diamond Dicing Blade for Silicon WaferResin Diamond Dicing Blade for Silicon Wafer

Resin Diamond Dicing Blade for Silicon Wafer

1A8 Ultra-thin diamond dicing blade (over 0.75mm)

Improve chipping, blade life on hard and brittle materials

Applications: glass, quartz, LiTa03 LiNb03, QFN, splitter, sapphire, ceramic, etc

Product Details

diamond dicing blade

Resin bonded blades have excellent cutting ability that help reduce chippingm fractures, can efficiency improve cut quality and efficiency on ductile and gummy materials such as QFNs and coppers and on hard and brittle materials such as glass and ceramic.

resin diamond dicing blade diamond dicing blade for silicon wafer

Applications of diamond dicing blade
Resin Bond Diamond Dicing Blades are suitable for cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), QFN (copper epoxy molding ), splitter, sapphire.

diamond dicing blade wafer dicing blade resin diamond dicing blade

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Drawing&Specification

Grit Type

OD (mm)

ID(mm)

T(mm)

Grit Size

1A8 SD / CBN

50.8

25.4

0.07 - 0.3

#200 - #3000

57.1

38.1

50.8-76.2

40

101.6 ,114.3

69.8

101.6, 114.3, 127

76.2

108.1, 127

88.82

108.1, 127

88.9

Special size can be designed depending on customers' requirement

 

 

Inquiry

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