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Diamond Dicing Blades For Wafer ScribingDiamond Dicing Blades For Wafer ScribingDiamond Dicing Blades For Wafer Scribing
Diamond Dicing Blades For Wafer ScribingDiamond Dicing Blades For Wafer ScribingDiamond Dicing Blades For Wafer Scribing

Diamond Dicing Blades For Wafer Scribing

* 1A8 Ultra-thin diamond dicing blade

* Blade thickness: 0.03 mm - 0.3 mm

* Silicon wafers of thickness:  0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
* Inducing as low as possible frontside and backside chipping of silicon wafer
* Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc
Product Details

diamond dicing blade

Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed . Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.

diamond dicing blades  diamond dicing blades  diamond dicing blades

How to selection of the correct types of wafer dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

 

Dresser Board for dressing dicing blades

Dresser board is used for dressing and edged blade row,  to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge

dresser board   Dresser board

Applications of wafer diamond dicing blade

Scribing / cutting silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

diamond dicing blade wafer dicing blade diamond dicing blade for silicon wader

dicing blade for wafer

Drawing&Specification

Types

Features

Product Name

electroformed diamond dicing blade

Electroformed dicing blade

• Good chip removal and cooling performance
• Can carry on the difficult angle cutting and the step cutting processing

• By adjusting the blades strength, can reduce the snake like cutting and blade damage 
• The workpiece has no flying edge, burr residue and high yield

 

 

 

 

Hub dicing blade

Application:  Scribing dicing IC wafers, gallium arsenide, gallium phosphide, epoxy resin board, alloy frame, ceramic substrate, composite board with interlayer, etc

resin diamond dicing blade

Resin bond dicing blade

• High processing quality for cutting of hard, brittle materials

• Improved cut quality on hard materials 

• Excellent cutting ability that help reduce chippingm fractures

 

 

 

 

 

 

 

 

Hubless dicing 

blade

Application: cutting scribing glass (optical devices, fiber optics), quartz (optical splitters, saw devices), LiTa03 LiNb03 (devices), BGA, QFN (copper epoxy molding ), splitter, sapphire, ceramic substrate, alumina, aliminum nitride, etc

metal diamond dicing blade

Metal bond dicing balde

• High rigidity minimized wavy & slant cutting

• Excellent rigidity and cut quality 

Application:  Scribing electronic parts, optical devices, semiconductor packages, BGA, CSP, PCB, ceramic, glass, quartz, crystal, ferrite, optical communication (Faraday), etc

 

diamond dicing blade

Electroformed dicing balde

• Wide selection of blade options

• Proprietary thin-blade technology

• Blade thickness - 0.03 mm to 0.3 mm

• Available for both dicing saws and slicers

Application:  Scribing dicing silicon wafers, copper wafer and compound semiconductor wafers ( such as GaAs and SiC) , resistance, ceramic, packaging materials, lithium niobate, lithium tantalate, etc

Other specification can be produced according to customers' requirements

The Case of Metal Diamond Dicing Blades for PCB

Workpiece

PCB  Material

1.2mm thick resin containing copper layer

diamond dicing blades for pcb

Dicing Requirements

Cutting without burrs

Incision perpendicularity < 0.005mm

Cutting dimensional error < 0.02mm

Snake cutting is not allowed

Dicing / Scribing Machine

Disco DAD3350 scribing machine

Diamond Dicing Blade

metal dicing blades

Metal Diamond Dicing Blade 

58D x 0.15T x 40H (Grit 400# )

Cutting Parameters

1. Cutting direction: Straight cutting

2. Spindle speed: 30000rpm

3. Feed speed: 50mm/S

4. Cooling water: pure water

 

Inquiry

Please Feel free to give your inquiry in the form below. We will reply you in 24 hours.

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