Diamond Dicing Blades For Semiconductor Industry
1A8 Ultra-thin diamond dicing blade
Blade thickness: 0.015 mm to 0.3 mm
Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, BGA, CSP, magnetic materials, PCB, silicon, etc
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spraying Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.
How to selection of the correct types of dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Applications of diamond dicing blade
Scribing / cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
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Types |
Features |
Product Name |
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Electroformed dicing blade |
Easy to handle
Variety of different grit concentrations
Stable processing performance |
Hub dicing blade |
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Application: Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3) |
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Resin bond dicing blade |
High processing quality for cutting of hard, brittle materials
Improved cut quality on hard materials |
Hubless dicing
blade |
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Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter |
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Metal bond dicing balde
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High rigidity minimized wavy&slant cutting
Excellent rigidity and cut quality |
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Application: Electronic parts, Optical devices, semiconductor packages, BGA, CSP, |
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Electroformed dicing balde |
Wide selection of blade options
Proprietary thin-blade technology
Blade thickness - 0.015 mm to 0.3 mm
Available for both dicing saws and slicers |
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Application: Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon |
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Other specification can be produced according to customers' requirements |
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