Products

Diamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor Industry
Diamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor Industry

Diamond Dicing Blades For Semiconductor Industry

For cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

For cutting Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

For cutting Electronic parts, Optical devices, semiconductor packages, BGA, CSP

For cutting Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

Product Details

Description:
Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade.

Diamond Dicing Blades

Application:

For cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

For cutting Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter

For cutting Electronic parts, Optical devices, semiconductor packages, BGA, CSP

For cutting Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

Drawing&Specification

Types

Features

Product Name

electroplated dicing blade

Electroformed dicing blade

Features: 

Easy to handle;

Variety of different grit concentrations;

Stable processing performance

 

 

 

 

Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

 

More Super Hard Products Co., Ltd

Resin bond dicing blade

Features: 

High processing quality for cutting of hard, brittle materials;

Improved cut quality on hard materials 

 

 

 

 

 

 

 

 

Hubless dicing 

blade

Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

 metal bond dicing blade

  

   Metal bond dicing balde

Features: 

High rigidity minimized wavy&slant cutting;

Excellent rigidity and cut quality 

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 

Electroformed dicing balde

Electroformed dicing balde

Features: 

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customer’s requirements

 

 

 

Inquiry

Please Feel free to give your inquiry in the form below. We will reply you in 24 hours.

  • *
  • *
 
Facebook
 
Twitter
 
LinkedIn
 
googleplus
 
youtube
 
pinterest
 
Instagram