





Diamond Dicing Blades For Wafer Scribing
* 1A8 Ultra-thin diamond dicing blade
* Blade thickness: 0.03 mm - 0.3 mm
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spray Coating Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Diamond dicing blade is used for grooving , cutting silicon wafer, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed . Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.
How to selection of the correct types of wafer dicing blades to cut materials
* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material
* Binder of metal bond (medium strength) dicing blade
* Binder of electroplated bond (hard bond), scribing softer material
Dresser Board for dressing dicing blades
Dresser board is used for dressing and edged blade row, to increase sharpness, and reduce the chipping of the work piece, to reshape and perfect the blade edge to a flat edge
Applications of wafer diamond dicing blade
Scribing / cutting silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon
Types |
Features |
Product Name |
|
Electroformed dicing blade |
• Good chip removal and cooling performance
• By adjusting the blades strength, can reduce the snake like cutting and blade damage |
Hub dicing blade |
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Application: |
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Resin bond dicing blade |
• High processing quality for cutting of hard, brittle materials
• Improved cut quality on hard materials • Excellent cutting ability that help reduce chippingm fractures
|
Hubless dicing
blade |
|
Application: |
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Metal bond dicing balde
|
• High rigidity minimized wavy & slant cutting
• Excellent rigidity and cut quality |
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Application: |
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Electroformed dicing balde |
• Wide selection of blade options
• Proprietary thin-blade technology
• Blade thickness - 0.03 mm to 0.3 mm
• Available for both dicing saws and slicers |
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Application: |
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Other specification can be produced according to customers' requirements |
The Case of Metal Diamond Dicing Blades for PCB
Workpiece |
PCB Material 1.2mm thick resin containing copper layer
|
Dicing Requirements |
Cutting without burrs |
Incision perpendicularity < 0.005mm |
|
Cutting dimensional error < 0.02mm |
|
Snake cutting is not allowed |
|
Dicing / Scribing Machine |
Disco DAD3350 scribing machine |
Diamond Dicing Blade
|
Metal Diamond Dicing Blade |
58D x 0.15T x 40H (Grit 400# ) |
|
Cutting Parameters |
1. Cutting direction: Straight cutting 2. Spindle speed: 30000rpm
3. Feed speed: 50mm/S 4. Cooling water: pure water
|
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