Diamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor Industry
Diamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor IndustryDiamond Dicing Blades For Semiconductor Industry

Diamond Dicing Blades For Semiconductor Industry

* 1A8 Ultra-thin diamond dicing blade

* Blade thickness: 0.015 mm to 0.3 mm

* Silicon wafers of thickness:  0.5 mm, 1 mm, 2 mm, 3 mm and 5 mm
* Inducing as low as possible frontside and backside chipping of silicon wafer
* Applications: Scribing silicon wafers, compound semiconductor wafers (GaAs, Gap), oxide wafers (LiTaO3),glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter,BGA, CSP,magnetic materials, PCB, silicon, etc
Product Details

diamond dicing blade

Diamond dicing blade is used for grooving ,cutting silicon, compound semiconductors, glass and other materials in electronic information industry. Diamond dicing blade is one of new products developed .Our dicing blades include diamond hub dicing blade and diamond hubless dicing blade. The binders include resin bond dicing blade, metal bond dicing blade and electroformed nickel dicing blade.

How to selection of the correct types of dicing blades to cut materials

* Binder of resin bond (soft strength) dicing blade, scribing hard and brittle material

* Binder of metal bond (medium strength) dicing blade

* Binder of electroplated bond (hard bond), scribing softer material

Applications of diamond dicing blade

Scribing / cutting Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3), glass, crystal, quart, LiTaO3, ceramics, optical, QFN, splitter, electronic parts, optical devices, semiconductor packages, BGA, CSP, various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon

diamond dicing blade wafer dicing blade diamond dicing blade for silicon wader

dicing blade for wafer




Product Name

electroformed diamond dicing blade

Electroformed dicing blade

Easy to handle

Variety of different grit concentrations

Stable processing performance





Hub dicing blade

Application:  Silicon wafers, compound semiconductor wafers (GaAs, Gap),oxide wafers (LiTaO3)

resin diamond dicing blade

Resin bond dicing blade

High processing quality for cutting of hard, brittle materials

Improved cut quality on hard materials 









Hubless dicing 


Application:Glass, Crystal, Quart, LiTaO3, Ceramics, Optical, QFN, splitter 

metal diamond dicing blade

Metal bond dicing balde

High rigidity minimized wavy&slant cutting

Excellent rigidity and cut quality 

Application:  Electronic parts, Optical devices, semiconductor packages, BGA, CSP, 


diamond dicing blade

Electroformed dicing balde

Wide selection of blade options

Proprietary thin-blade technology

Blade thickness - 0.015 mm to 0.3 mm

Available for both dicing saws and slicers

Application:  Various types of semiconductor packages, ceramics, magnetic materials, PCB, silicon 

Other specification can be produced according to customers' requirements

The Case of Metal Diamond Dicing Blades for PCB


PCB  Material

1.2mm thick resin containing copper layer

diamond dicing blades for pcb

Dicing Requirements

Cutting without burrs

Incision perpendicularity < 0.005mm

Cutting dimensional error < 0.02mm

Snake cutting is not allowed

Dicing / Scribing Machine

Disco DAD3350 scribing machine

Diamond Dicing Blade

metal dicing blades

Metal Diamond Dicing Blade 

58D x 0.15T x 40H (Grit 400# )

Cutting Parameters

1. Cutting direction: Straight cutting

2. Spindle speed: 30000rpm

3. Feed speed: 50mm/S

4. Cooling water: pure water



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