electroformed hub type diamond dicing blade

Electroformed hub type diamond dicing blade for semiconductor packaging

Diameter：56, 58mm

Thickness:006-0.32mm

Grit:340#-1200#

For dicing Ceramic LED substrates, semiconductor packaging substrates, PZT, TGG and other hard and brittle materials

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Product Details

The electroformed hub type diamond dicing blade has good wear resistance and better blade stability. Electroformed hub type diamond dicing blade can effectively control the side steps of chip particles and ensure the particle size.

Application of electroformed hub type diamond dicing blade:

Electroformed hub type diamond dicing blade is suitable for ceramic LED substrates, semiconductor packaging substrates, PZT, TGG and other hard and brittle materials.

Case of electroformed hub type diamond dicing blade for LED ceramic substrate:

Dicing Blade：HS25 56×3.0x0.12B 500S30S16
Substrate Type	ceramic，LED bead
Substrate THK	Adhesive layer 0.75mm + substrate 0.71mm
Size	5x5mm
Spindle speed	25k rpm
In feed speed	3mm/s
Quality requirement	Front and back surfaces are smooth, with no chipping or cracks on the sides, and no steps or ledges on the side profile.

Case of electroformed hub type diamond dicing blade for LED bead:

Dicing blade：HS25 58×3.0x0.16B 600S30S48
Substrate Type	ceramic，LED bead
Substrate THK	0.5mm
Size	3x5mm
Spindle speed	45k rpm
In feed speed	15mm/s
Quality requirement	Front and back surfaces are free of chipping, with no cracks or steps on the side profile

Drawing&Specification

Diameter (mm)	Exposure (0/+0.2mm)	Thickness (mm)	Thickness tolerance（mm）	Grit	Bond	concentration	Number of grooves
56	2.0	0.06	±0.05 ±0.10 ±0.15	1200	S N H	30	16 32 48
	2.2	0.08
	2.4	0.10		1000		50
	2.6	0.12
	2.8	0.14		800		70
	3.0	0.16
	3.2	0.18		600		90
58	3.4	0.20
	3.6	0.22		500		110
	3.8	0.24
	4.0	0.26		400		130
	4.2	0.28
	4.4	0.30		340		150
	4.6	0.32