LED and Semiconductor Industry
Manufacturing processes for silicon semiconductor in semocinductor
Silicon Ingot – Cropping(electroplated bandsaw) – Cylindrical / Flat Grinding Silicon Rod – Ingot Silicon (diamond wire) – Lapping (double side wheel/polishing pad) – Edge Grinding – Surface grinding – polishing- wafer- patterning – back grinding (vitrified / resin wheels) – dicing (dicing blades)- chips – molding – packaging
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Back Grinding Wheel for Surface Grinding Various Silicon Wafer
Back Grinding Wheel for Surface Grinding Various Silicon Wafer
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Metal bond Diamond Dicing Blades
Metal bond Diamond Dicing Blades
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Electroformed Diamond Dicing Blade - Hub Type
Electroformed Diamond Dicing Blade – Hub Type
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Resin Diamond Dicing Blade for Silicon Wafer
Resin Diamond Dicing Blade for Silicon Wafer
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Diamond Dicing Blades For Wafer Scribing
Diamond Dicing Blades For Wafer Scribing
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Resin diamond dicing blade for QFN package