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Back Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon Wafer
Back Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon WaferBack Grinding Wheel for Surface Grinding Various Silicon Wafer

Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc


Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc


Bonded: Vitrified bond & Resin bond

 

Diameter: 200mm, 250mm, 280mm, 300mm,  350mm

Product Details

Manufacturing Processes for Silicon Wafers

Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......

back grinding wheels

 

Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

back grinding wheel back grinding wheel

Advantages of back grinding wheel for various wafer

* With low damage and high quality

* Nodeless consecutive processing is possible by the superior sharpness

* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs

* Cool polished section

* Good surface finishes

Drawing&Specification

Model

D (mm)

T (mm)

H (mm)

Silicon grinding wheels

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

Silicon grinding wheels

6A2T

195

22.5, 25

170

280

30

228.6

Silicon grinding wheels

6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers’ requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry

back grinding wheel for silicon wafer

Application Grinding wafer silicon in the microchip industry
Bonded Vitrified bond Diamond Wheel
Wheel Type 12A2T /C
Size 180*40*104*5*10, grit size  400#
180*40*104*5*10, grit size 1500#
180*40*104*5*10,  grit size 4000#

 

Inquiry

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