Diamond Wheels for Surface Grinding Various Wafer

Manufacturing Processes for Silicon Wafers

Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
 

Applications of back grinding wheel
back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, gallium arsenide, GaN wafers, silicon-based chips, etc

 

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc

Advantages of diamond grinding wheel for various wafer

* With low damage and high quality.

* Nodeless consecutive processing is possible by the superior sharpness.
 * It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs.