Back Grinding Wheel for Surface Grinding Various Silicon Wafer

Manufacturing Processes for Silicon Wafers
Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips.

Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc

Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

Advantages of back grinding wheel for various wafer
* With low damage and high quality
* Nodeless consecutive processing is possible by the superior sharpness
* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs
* Cool polished section
* Good surface finishes

Model	D (mm)	T (mm)	H (mm)
6A2/6A2H	175	30, 35	76
	200	35	76
	350	45	127
6A2T	195	22.5, 25	170
	280	30	228.6
6A2T(three ellipses)	350	35	235
	209	22.5	158
Other specifications can be produced according to customers’ requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry