





Back Grinding Wheel for Surface Grinding Various Silicon Wafer
Application: back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc
Bonded: Vitrified bond & Resin bond
Diameter: 200mm, 250mm, 280mm, 300mm, 350mm
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spray Coating Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Manufacturing Processes for Silicon Wafers
Ingot, cropping, Peripheral grinding, Ingot slicing, double disc grinding or lapping, edge grinding, surface grinding, polishing, back grinding, dicing, chips......
Applications of back grinding wheel
Back thinning, front grinding and fine grinding of discrete devices, integrated circuit substrate silicon wafers, sapphire epitaxial wafers, silicon wafers, arsenide, GaN wafers, silicon-based chips, etc
Applicable Grinding Machine
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).
Advantages of back grinding wheel for various wafer
* With low damage and high quality
* Nodeless consecutive processing is possible by the superior sharpness
* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs
* Cool polished section
* Good surface finishes
Model |
D (mm) |
T (mm) |
H (mm) |
6A2/6A2H |
175 |
30, 35 |
76 |
200 |
35 |
76 |
|
350 |
45 |
127 |
|
6A2T |
195 |
22.5, 25 |
170 |
280 |
30 |
228.6 |
|
6A2T(three ellipses) |
350 |
35 |
235 |
209 |
22.5 |
158 |
|
Other specifications can be produced according to customers’ requirement. |
The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry
Application | Grinding wafer silicon in the microchip industry |
Bonded | Vitrified bond Diamond Wheel |
Wheel Type | 12A2T /C |
Size |
180*40*104*5*10, grit size 400# 180*40*104*5*10, grit size 1500# 180*40*104*5*10, grit size 4000# |
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