Products

Silicon grinding wheels/Silicon Wafer Back Grinding WheelsSilicon grinding wheels/Silicon Wafer Back Grinding WheelsSilicon grinding wheels/Silicon Wafer Back Grinding Wheels
Silicon grinding wheels/Silicon Wafer Back Grinding WheelsSilicon grinding wheels/Silicon Wafer Back Grinding WheelsSilicon grinding wheels/Silicon Wafer Back Grinding Wheels

Silicon grinding wheels/Silicon Wafer Back Grinding Wheels

High efficiency

High precision

Easy processing

Product Details

Description:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.

Silicon grinding wheels

Application:
Back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine.

Advantages:
1.High efficiency
2.High precision
3.Easy processing

Drawing&Specification

Model

D (mm)

T (mm)

H (mm)

Silicon grinding wheels

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

Silicon grinding wheels

6A2T

195

22.5, 25

170

280

30

228.6

Silicon grinding wheels

6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers’ requirement.

Inquiry

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