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Back Grinding Wheel for LED SubstrateBack Grinding Wheel for LED SubstrateBack Grinding Wheel for LED Substrate
Back Grinding Wheel for LED SubstrateBack Grinding Wheel for LED SubstrateBack Grinding Wheel for LED Substrate

Back Grinding Wheel for LED Substrate

 Application: LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers

Grinding Machines: NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH, etc

Bonded: Vitrified bond & Resin bond

Diameter of Back Grinding Wheel: 200mm, 250mm, 280mm, 300mm,  350mm

Diameter of Epitaxial Wafer: 2", 4", 6"

Product Details

 

Applications of LED epitaxial wafer back grinding wheel

LED industry for back grinding of sapphire wafers, silicon wafers, gallium arsenide, and gallium nitride wafers. It works well with European, American, Japanese and Chinese grinding machines with an excellent performance and cost effectiveness.

Applicable Grinding Machine

The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders ( Such as NTS, SHUWA, ENGIS, Okamoto , Disco, TSK and STRASBAUGH grinding machine, etc ).

back grinding wheel back grinding wheel

Advantages of back grinding wheel for various wafer

* With low damage and high quality

* Nodeless consecutive processing is possible by the superior sharpness

* It helps minimize processing damage, improve processing efficiency and reduce processing cost, and is customizable according to customer needs

* Cool polished section

* Good surface finishes

Drawing&Specification

Model

D (mm)

T (mm)

H (mm)

Silicon grinding wheels

6A2/6A2H

175

30, 35

76

200

35

76

350

45

127

Silicon grinding wheels

6A2T

195

22.5, 25

170

280

30

228.6

Silicon grinding wheels

6A2T(three ellipses)

350

35

235

209

22.5

158

Other specifications can be produced according to customers’ requirement.

The case of vitrified diamond wheel for grinding wafer silicon in the microchip industry

back grinding wheel for silicon wafer

Application Grinding wafer silicon in the microchip industry
Bonded Vitrified bond Diamond Wheel
Wheel Type 12A2T /C
Size 180*40*104*5*10, grit size  400#
180*40*104*5*10, grit size 1500#
180*40*104*5*10,  grit size 4000#

 

Inquiry

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