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Hexagonal resin diamond polishing pads
Hexagonal resin diamond polishing pads
lapping

Hexagon Resin diamond lapping pad

Diamond Lapping Pad

Application: Sapphire, SiC, glassy materials and crystals

For single or double surface lapping machine

Diameter: 200mm, 254mm, 300mm, 370mm, 515mm, 530mm, 910mm, 1055mm, 1145mm

Microstructure: block (2.6mm*2.6mm*0.9mm)

Substrate class :PET composite PC board

Abrasive size: 45micro 20micro, 9micro, 6micro ,  4micro,   2micro


Product Details

Diamond Lapping Pad

Diamond lapping pads eliminate the need for slurry mixing, saving polishing time and improving the workshop environment. They significantly reduce slurry-free treatment costs and environmental cleaning expenses. The pads adhere to the grinding disc via adhesive backing for easy installation and removal. Diamond grinding pads can be directly mounted onto existing grinding/polishing discs.

The abrasive is embedded within the grinding pad, achieving a highly efficient and stable removal rate, increasing grinding efficiency by >2 times, shortening CMP time by >20%, and achieving a grinding rate more than twice that of slurry grinding processes with the same abrasive particle size. They ensure superior workpiece planarity control performance (TTV, Warp, Bow). The adhesive backing allows for easy installation and removal, and the fixed grinding pads can be directly mounted onto existing machine plates. Alternative to 3M Trizact series.

diamond lapping pad

Application of diamond lapping pad:

Diamond lapping pad is used in the lapping and thinning process of hard and brittle materials such as glass substrates (microcrystalline, quartz, borosilicate, white board, sapphire), semiconductor wafers (monocrystalline silicon, silicon carbide), piezoelectric terminals (lithium tantalate), and precision ceramics (aluminum oxide, aluminum nitride, silicon nitride).

Optical glass: float glass/K9/quartz/BK7/fused silica/microcrystalline/prism, etc., infrared silicon-germanium, ceramic substrates

lapping lapping

Features of diamond lapping pad:

* Shallower subsurface damage layer, beneficial for subsequent processing.

* Energy-saving and environmentally friendly, providing a cleaner working environment;no need to build a waste liquid sedimentation tank.

* Lower production costs compared to using free abrasives.

Hexagonal resin diamond polishing pads

Hexagonal resin diamond polishing pads are mainly used to match the diamond compound; as an effective polishing tool for the lapping section of plane grinding. Hexagonal resin diamond polishing pads can better store liquid and improve the efficiency of plane grinding by 50%.

The surface of the hexagonal resin diamond polishing pad is composed of many honeycomb holes of the same size, each of which has a certain depth, forming a three-dimensional network structure. The surface grooves of the hexagonal resin diamond polishing pad can effectively store and transport liquid, improve the utilization and stability of the agglomerated liquid and polishing liquid, and also help to remove the residues generated during the grinding and polishing process and reduce the generation of micro scratches.

 

Advantages of hexagonal resin diamond polishing pad

The three-dimensional network structure of the hexagonal resin diamond polishing pad can also provide a larger contact area, increase the material removal rate, shorten the polishing time, and reduce the grinding and polishing cost. In addition, the hexagonal resin diamond polishing pad has good thermal conductivity, which can effectively reduce the temperature rise during the polishing process, maintain the stability of the size and shape of the grinding and polishing pad, and improve the accuracy and consistency of grinding and polishing.

Diamond lapping pad is mainly used with BD-009 Polishing Slurry. As an effective polishing  tool for lapping section of plane grinding, hexagonal resin diamond polishing pads can better store liquid and increase grinding efficiency of the plane by 50%.

Drawing&Specification
Application Finishing or polishing
Application Category Sapphire, SiC ,glassy materials and crystals
Attachment Type PSA
Brand More Superhard
Color Family White
Equipment – Machines Biplanar Grinder
Overall Diameter (Imperial) 1290mm×350mm
Thickness Total thickness 2.34mm, plate thickness 2.24mm side length 1.1mm, spacing 1.77mm

 

Specification of diamond lapping pad

No Grain Thickness
Y 4、9、20um 2.20mm
F 4、9、20um 2.00mm
YF 4、9、20um 2.60mm

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