Electroformed hub type diamond dicing blade for cutting wafer
Case of Electroformed hub type diamond dicing blade for cutting wafer
| Workpiece parameters | |
| Wafer Material | LiNbO3 |
| Wafer size | 100mm |
| Wafer thickness | 1mm |
| Chip size | 1.3mm*1.5mm |
| Cutting lane width | 0.08mm |
| Quality requirements: Front chipping size: 0.005mm, Back chipping size : 0.010mm
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Current process parameters:
| Film type | UV film |
| Processed shape | round |
| Speed of mainshaft | Z1=15000rpm |
| Feed speed | 0.5mm/s |
| Blade height | Z1=0.100mm |
| Cooling water flow | 1.5L/min |
