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More SuperHard Meet You In CIOE 2019

2019-09-07

China International Optoelectronic Exposition (CIOE) was held in shenzheng international convention and exhibition center from September 4 to 7, 2019.More super Hard were invited to attend the exhibition.

  CIOE 2019 CIOE 2019

Diamond grinding wheels are used for silicon wafer grinding. our advanced technology makes back grinding wheel possible to grind all types of semiconductor wafers with less subsurface damage.

 DIAMOND GRINDING WHEEL DIAMOND GRINDING WHEEL  DIAMOND GRINDING WHEEL

More Superhard diamond / CBN grinding disc including resin diamond / CBN grinding disc, vitrified diamond / CBN grinding disc, double-disc surface grinding disc, pellet grinding wheel and so on.

DIAMOND GRINDING WHEEL DIAMOND LAPPING TOOLS

More Superhard provides polyurethane (PU) polishing pads. Abrasive fillers include cerium and zirconium, some pads do not have abrasive filler.

Dicing blades are used for cutting silicon wafers, copper wafer, LED Packages, hard and brittle materials

 

More SuperHard Products Co., Ltd is dedicated to finding solutions that help our clients in all markets succeed. More SuperHard has been manufacturing high-quality, competitively priced superabrasive diamond and cbn tools that are designed to perform in a wide range of industrial ,such as PCD Tools Grinding, Natural Diamond Polishing, Auto Parts Processing , Thermal Spray Coated Industry, Optical Glass, Semicon and LED Industry, Woodworking Tool , CNC Tool Grinding and Roll Machining ,others ultral precision industry.