





Back Grinding Wheels for Silicon Wafer Thinning
Surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;
Processing accuracy: TTV <5 um etc. (Total thinning veracity)
Processing quality:surface roughness: < 10 nm; damage layer thickness: < 10 um
Cutting Tool Industry
Diamond Jewelry Industry
Automotive Industry
Bearing Industry
Woodworking Industry
Thermal Spray Coating Industry
Glass Industry
Oil&GAS Industry
LED & Semiconductor Industry
Medical Industry
Aviation and Turbine Industry
Dressing Tools
Diamond & CBN Grinding Wheels
Honing Tools
End Surface Grinding
Description:
Silicon grinding wheels are mainly used for trimming of silicon wafer. These products produced by our institute,which possess superior grinding performance and high cost performance,are among the top level worldwide.
Application: back thinning, grinding and fine grinding of apphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.
Applicable Grinding Machine:
The back grinding wheels can be used for the Japanese ,German, American, Korean and other grinders . Such as Okamoto , Disco, Strasbaugh and others grinding machine
Advantages:
1.surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;
2.processing accuracy: TTV <5 um etc. (Total thinning veracity)
3.Processing quality:surface roughness: < 10 nm; damage layer thickness: < 10 um
Model |
D (mm) |
T (mm) |
H (mm) |
6A2/6A2H |
175 |
30, 35 |
76 |
200 |
35 |
76 |
|
350 |
45 |
127 |
|
6A2T |
195 |
22.5, 25 |
170 |
280 |
30 |
228.6 |
|
6A2T(three ellipses) |
350 |
35 |
235 |
209 |
22.5 |
158 |
|
Other specifications can be produced according to customers’ requirement. |
Related Products
-
nodata
Please Feel free to give your inquiry in the form below. We will reply you in 24 hours.