Electroformed hub type diamond dicing blade for cutting wafer
Case of Electroformed hub type diamond dicing blade for cutting wafer
Workpiece parameters | |
Wafer Material | LiNbO3 |
Wafer size | 100mm |
Wafer thickness | 1mm |
Chip size | 1.3mm*1.5mm |
Cutting lane width | 0.08mm |
Quality requirements: Front chipping size: 0.005mm, Back chipping size : 0.010mm
|
Current process parameters:
Film type | UV film |
Processed shape | round |
Speed of mainshaft | Z1=15000rpm |
Feed speed | 0.5mm/s |
Blade height | Z1=0.100mm |
Cooling water flow | 1.5L/min |