Dicing Blade selection for wafer cutting
At present, most of the wafer cutting is using high precision scribing machine, which is mainly mechanical processing.
Under the action of mechanical stress, the wafer is prone to quality abnormalities after cutting. Common quality abnormalities include: product surface, back Chipping, PAD oxidation, delamination, missing Angle and other abnormalities.
Main product for wafer cutting
Mounting Tape
DI Water
Diamaflow
Comressed Air, N2.
Main parameters of dicing processing
Cutting pattern
Feed speed
The blade rotation speed Cutting depth
Cooling water flow
How to choice of diamond dicing blades
1. Grit
2. Concentration
3. Binding agent characteristics
4. Blade length
5. Blade thickness
Usually, use SD (synthetic diamond) with particle sizes from 1μm to 8μm for cutting wafer, In order to achieve better cutting quality, diamond particles with edges and corners is better.
