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Diamond Dicing Blade for DFN Semiconductor packaging

December 02, 2020

01 Principle of Diamond Dicing Blade for DFN

The Diamond dicing blade is mounted on the soft blade flange of the cutting equipment's spindle. Under high-speed rotation of the spindle at RPM 20,000 to 30,000, the workpiece to be cut are broken by fracturing way and the chip pocket to remove the chips in time to ensure the processing quality.

 

02 Processing

Machine

DICCO 350

Diamond dicing blade

1A8 SD240

58x0.3x40

Work piece

DFN 2X2

Spindle speed

25000RPM

Size

256x70mm

DIE size

2.0x2.0mm

Cooling water temperature

12±2°

Cooling water flow

1.5L/m

Work piece material

Cooper + epoxy resin

Feed speed

40mm/s

Cut mode

Single shaft cut through

Cutting time

15minutes

Processing way

UV film cut

Cutting height

0.1mm

Work piece thickness

0.75mm

Film thickness

0.15mm

Cutting width

0.3mm

Cutting life

2000m

 

03 Result

No burr, fracture and metal lamination were examined under 40 power microscope.  

Diamond dicing blade

 
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